HD A/C Card PCB Assembly with Lead-free Capability, RoHS Directive-compliant

Key Specifications/Special Features

• Fast response for RFQ and prototyping build
• Flexible production for customer required high mix, low and medium volume
• Simple, complicated boards and components available
• High placement precision in ball grid array (BGA) and through hole assembly
• Our dedication to quality service is understood by our strict adherence to IPC-A-610E standards
• Lead-free process capability
• With nice supply chain management and production quality control
• Provides contract electronics manufacturing services to all sorts of OEM printed circuit board assemblies as well as finished products/box-building:
  • High speed SMT and DIP assembly
  • Conformal coating
  • Silkscreen/pad painting
  • AOI inspection
  • X-ray inspection
  • In circuit test and functional test
  • Reliability test
  • Special processes as per customer’s request
  • Plastic molding and injection
  • Metal stamping and punching
• Customized testing programming and fixtures are accepted
• OEM orders are warmly welcome
• Our operations run according to ISO 9001:2008, ISO 13485:2003, ISO 14001:2004 and ISO/TS 169492009