1 Layer PCB with 2oz Copper, 2.5 Thickness

Key Specifications/Special Features

• Layer count: one layer
• Major material: copper
• Board thickness: 2.5mm
• Surface finishing: Lead-free HASL
• Solder mask: white
• Copper thickness: 2oz
• Minimum hole size: 0.3mm
• Minimum line width and spacing: 4mil
• Manufacturer capability:
  • Material: FR-4/Hi Tg FR-4/lead free, (RoHS compliant)/CEM-3, aluminum, metal based
  • Layer numbers: 1-16
  • Finished board thickness: 0.2-3.5mm, (8-138 mil)
  • Board thickness tolerance: ±10%
  • Cooper thicknesses: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
• Image:
  • Minimum trace width (a): 0.075mm (3 mil)
  • Minimum space width (b): 0.075mm (3 mil)
  • SMD pitch (a): 0.2mm(8 mil)
  • BGA pitch (b): 0.2mm (8 mil)
• Solder mask:
  • Minimum solder mask dam (a): 0.0635mm (2.5mil)
  • Soldermask clearance (b): 0.075mm (3 mil)
  • Minimum SMT pad spacing (c): 0.075mm (3 mil)
  • Solder mask thickness: 0.0007"(0.018mm)
• Holes:
  • Minimum hole size (CNC): 0.2mm (8mil)
  • Min punch hole size: 0.9mm (35 mil)
  • Hole size tol (+/-): PTH: ±0.075mm, NPTH: ±0.05mm
  • Hole position tol: ±0.075mm
• Plating:
  • HASL/lead free HASL: 2.5um
  • Immersion gold nickel: 3-7um, Au: 1-5u''
  • OSP: 0.2-0.5um
  • Certificates: RoHS, ISO9001:2008, SGS and UL