Double-sided PCB with Immersion Gold Finish, Ideal for Electronic Products

Key Specifications/Special Features

• Layers: 2
• Board materials: FR4, Tg130
• Board thickness: 0.062-inch
• Surface finish: immersion gold
• Copper thickness:
  • Outer layer: 1oz
  • Inner layer: 0.5oz
• Solder mask: green
• Minimum trace width/gap: 0.15mm (minimum)
• Aperture: 0.3mm (minimum)
• Peel strength: 1.25
• Solder blister resistance: ≥60 (288°C)
• Flammability: UL94 V0
• Outline tolerance:
  • CNC: 0.125mm
  • Punching: 0.15mm
• Warp and twist: 0.70%
• Minimum solder mask bridge: 0.0635mm
• Minimum distance between line to board bridge:
  • Outline: 0.25mm
  • V-cut: 0.40mm
• Impedance control tolerance: ±10%
• Test voltages: 10 to 300V