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Shenzhen Ams Electronic Technology Co. Ltd

contact:Niki Zhang

phone:0086-13600648702

Mobile phone:0086-18270063049

Fax:0086-7975559503

Skype:zhcircuitgroup

MSN:zxhcircuit@msn.com

mail:niki@zxhgrouppcb.com

Web site:http://www.zxhgrouppcb.com

Address:10building.GangBei industrial park.HuangTian,xixiang.baoan shenzhen china.

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Mobile Phone PFC Board

 Mobile Phone PFC Board

 

Key Specifications/Special Features

  • Number of layers: 8(flexible)
  • Base material thickness: 25um
  • Copper conductor thickness: 18um
  • Materials: polyester and polyimide
  • Copper: RA/ED
  • Minimum hole diameter: 0.15mm
  • Minimum line/space width: 0.075mm
  • Minimum annular ring: 0.1mm
  • Maximum panel size: 400 x 400mm
  • Plating: solder, nickel and gold
  • Volume resistivity: 1 x 1015 (IPC-TM-650 2.5.6.17)
  • Dissipation factor (1MHz): 0.04 (mil-P55617)
  • Solder heat resistance: 300°C/10 seconds
  • Dielectric strength: 5kV (IPC-TM-650 2.5.6.1)
  • Insulation resistance: 1000mW (IPC-TM-650: 2, 6, 3, 2 at ambient)
  • Peeling strength (180° direction): 1.0kg/cm (IPC-TM-650 2.4.9)
  • Flammability: 94 V-0 (UL94)
  • Surface resistance: 5 x 1012 (IPC-TM-650 2.5.6.17)
  • Dissipation factor (1MHz): 0.04 (mil-P-55617)
  • With RoHS Directive-compliant 

Product Details

Primary Competitive Advantages:

  • Green Product
  • Guarantee/Warranty
  • International Approvals
  • Price
  • Prompt Delivery
  • Service
  • Small Orders Accepted
  • Prompt Reply within 5 Hours

Main Export Markets:

Eastern Europe

North America

Mid East/Africa

Central/South America

Asia

Western Europe

Australasia

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